• Purpose: System scaling, remote I/O, additional I/O capacity

• Architecture: TMR (3‑2‑0 fault tolerant)

• Safety Certification: IEC 61508 SIL 3 / SIL 4, TÜV certified

• Compatibility: T8100 Processor Chassis, T8400 Controller Chassis, T8240 Power Shelf, T8310/T8311 Expander Processors

• Typical Applications: ESD, F&G, BMS, Turbine Control, High‑Integrity Process Safety

2. Product Overview

• 14 single‑width I/O slots for Trusted T84xx/T81xx I/O modules

• Redundant 24 V DC backplane power (from external T8240 power shelf)

• TMR Inter‑Module Bus (IMB) for fault‑tolerant communication

• 2500 V DC isolation between field circuits and system backplane

• Hot-swap I/O support (modules can be replaced online)

3. Specifications

3.1 Mechanical

• Form Factor: 19” rack × 6U (268 mm H) × 312 mm D

• Width: 483 mm (19 in)

• Weight: 5 kg (11 lb)

• I/O Slots: 14 × single‑width (T84xx, T81xx series)

• Mounting: Horizontal 19” rack, front-to-rear airflow

• Construction: Steel chassis, EMC-shielded

• Grounding: PE protective earth terminal

3.2 Electrical (Backplane)

• Supply Voltage: 20–32 V DC (nominal 24 V DC)

• Power Source: Redundant feeds from T8240 Power Shelf

• Max Backplane Current: 20 A

• Fusing: External 20 A fuse per power feed

• Backplane Connector: DIN 41642 (male, 14 positions)

• Field Isolation: 2500 V DC

• Power Dissipation: 80 W maximum

3.3 Environmental

• Operating Temperature: –5 °C to +60 °C

• Storage Temperature: –25 °C to +70 °C

• Humidity: 5–95 % RH, non‑condensing

• Altitude: ≤ 2000 m

• Vibration: IEC 60068‑2‑6 (1 g, 10–150 Hz)

• Shock: IEC 60068‑2‑27 (15 g, 11 ms)

• Protection Rating: IP40 (when cabinet-mounted)

• Hazardous Area: ATEX II 3G Ex ec IIC T4 Gc

3.4 Communication (IMB to Main Chassis)

• Protocol: Trusted IMB (Inter‑Module Bus), TMR fault‑tolerant

• Copper Cable: TC‑301 (shielded twisted pair)

• Max Copper Distance: 30 m

• Max Fiber Distance: 10 km (with fiber media converters)

4. Backplane Address Setting (DIP Switches)

• Rules:

  • All three switches must be set to the same value.

  • First expander = 2, second = 3, …, up to 8.

  • 1 = Off, 0 = On (down = logic 1).

5. Compatibility & Accessories

5.1 Required Accessories

• T8240: 1U Power Shelf (provides redundant 24 V DC)

• T8310: Expander Processor (main chassis, controls T8300)

• TC‑301: 30 m copper link cable (T8310 ↔ T8300)

5.2 Compatible I/O Modules (Examples)

• T8401: 16‑ch 24 V DC Digital Input

• T8402: 16‑ch Digital Output (24 V DC)

• T8403: 8‑ch Analog Input (4–20 mA)

• T8404: 8‑ch Analog Output (4–20 mA)

• T8451: 8‑ch RTD Input

• T8461: 8‑ch Thermocouple Input

• T849x: Blanking Plates (for unused slots)

6. Installation

6.1 Rack Mounting

1. Insert the T8300 into a standard 19” rack (6U height).

2. Secure front ears with 4 × M5 screws.

3. Maintain ≥100 mm front and rear clearance for airflow.

4. Connect chassis PE ground to system single‑point earth.

6.2 Power Wiring (from T8240)

1. Run redundant 24 V DC from T8240 to T8300 rear terminal block.

2. Observe correct polarity (+24 V / GND).

3. Use 14–18 AWG stranded wire.

4. Install 20 A external fuse on each power feed.

6.3 Communication Cable (T8310 ↔ T8300)

1. Connect one end of TC‑301 to the IMB port on the T8310 Expander Processor (main chassis).

2. Connect the other end to the IMB port on the T8300 rear panel.

3. Tighten connector screws; avoid sharp bends (min. bend radius = 8× cable diameter).

6.4 I/O Module Installation (Hot‑Swap)

1. Align module with chassis top/bottom guides.

2. Push firmly until the module is fully seated (backplane connector engaged).

3. Close the front latch to secure.

4. Fill unused slots with T849x blanking plates for EMC compliance.

7. Operation & Status Indicators

• T8310 Expander Processor (in main chassis)

• Individual I/O modules (PWR, OK, FAULT LEDs)

Typical I/O Module LED Status

• PWR (Green): On = DC power OK; Off = No power

• OK (Green): On = TMR health OK; Flashing = Minor fault

• FAULT (Red): On = Critical fault (overvoltage, overcurrent, overtemperature)

8. Maintenance & Troubleshooting

8.1 Routine Maintenance

• Quarterly: Inspect module seating, latch tightness, and LED status.

• Annually: Clean chassis with dry lint‑free cloth; check cable connections and torque.

8.2 Common Issues

• No I/O Module PWR: Check 24 V DC feed from T8240; verify fuse; reseat module.

• IMB Communication Fault: Check TC‑301 cable; verify DIP switch address; reseat T8310.

• High Temperature: Check ambient temperature; verify airflow; clean vents.

• Module FAULT LED: Replace faulty I/O module; check field wiring for short circuits.

9. Safety & Compliance

• Install only in Trusted T8000 system environments.

• Disconnect AC power before wiring (except hot‑swap module replacement).

• Use shielded cables; comply with IEC 61000‑6‑2 / 6‑4.

• Certifications: CE, UL, CSA, IEC 61508 SIL 3 / SIL 4, TÜV certified.

10. Ordering Information

• T8300: Trusted 6U Expander Chassis (14 I/O slots)

• T8240: 1U Power Shelf

• T8310: Expander Processor

• TC‑301: 30 m IMB Copper Cable

• T849x: Blanking Plates