Main technical parameters (simplified)

1. FPGA core

Model: Virtex-II XC2V3000 (3M logic gates)

Resources: Approximately 30,720 flip-flops, 96×18×18 multipliers, 1.728 Mbit block RAMNI

Development: LabVIEW FPGA graphical programming, hardware direct execution

2. Digital I/O (DIO)

Number of channels: 160 bidirectional DIO (each channel can be independently set as input/output)

Rate: Up to 40 MHz (hardware timing)

Function configuration:

TTL digital input/output

32-bit counter/timer, PWM output

Encoder A/B/Z phase (up to 40 MHz)

Custom serial protocols (SPI, UART, I2C, etc.)

Isolation: I/O isolated from the chassis at 2500 Vrms, strong anti-interference

3. Synchronization and storage

Synchronization bus: RTSI (multi-card synchronization, 25 ns synchronization accuracy)

On-board cache: 196 KB FIFO, supports DMA high-speed streaming data

FPGA RAM: 1.728 Mbit block RAM (user available) NI

4. Electrical and environmental

Power supply: +3.3 V @ 1.2 A; +5 V @ 15 mA

Power consumption: Approximately 4 W

Operating temperature: 0 - 55 °C (standard)

Size: Standard half-length PCI (170 × 109 mm)

5. Typical Applications

High-speed digital I/O control: Semiconductor testing, electronic manufacturing, ATE

Hardware-in-the-loop (HIL): Real-time control algorithm simulation, ECU testing

Precise timing / triggering: Pulse sequence generation, synchronous sampling, 25 ns timing

Motion control: Multi-axis high-speed pulse output, encoder acquisition, electronic gearing

Custom protocols: Dedicated serial ports, parallel interfaces, high-speed communication buses