MVME1603-053
May 15, 2026

MVME1603-053

MVME1603‑053 6U VME Single‑Board Computer (SBC) Motorola / Emerson / Curtiss‑Wright Plain Text Specification & User Manual Part Number: MVME1603‑053 Manufacturer: Motorola Computer Group, later Emerson / Artesyn / Curtiss‑Wright Form Factor: 6U double‑high VMEbus, VME64, P1/P2, Rev C compliant Processor: PowerPC 603 @ 66 MHz Memory: 64 MB ECC DRAM Key Attributes: Extended temperature (−40 °C ~ +70 °C), conformal coated, ruggedized, MVME760 compatible Baseboard: MVME1600‑011 (P2 routed for MVME760) Mezzanine: PM603 + RAM104‑004 (64 MB ECC)

Description

MVME1603-053.jpg

MVME1603-053(2.jpg

MVME1603‑053

6U VME Single‑Board Computer (SBC)

Motorola / Emerson / Curtiss‑Wright

Plain Text Specification & User Manual

Part Number: MVME1603‑053
Manufacturer: Motorola Computer Group, later Emerson / Artesyn / Curtiss‑Wright
Form Factor: 6U double‑high VMEbus, VME64, P1/P2, Rev C compliant
Processor: PowerPC 603 @ 66 MHz
Memory: 64 MB ECC DRAM
Key Attributes: Extended temperature (−40 °C ~ +70 °C), conformal coated, ruggedized, MVME760 compatible
Baseboard: MVME1600‑011 (P2 routed for MVME760)
Mezzanine: PM603 + RAM104‑004 (64 MB ECC)
Ordering Code Meaning (1603 series):
‑011 = 64 MB ECC, 0–55 °C, MVME760
‑012 = 8 MB non‑ECC, 0–55 °C, MVME760
‑042 = 8 MB non‑ECC, −40~+70 °C, rugged, MVME760
‑053 = 64 MB ECC, −40~+70 °C, rugged, MVME760

1. General Description

The MVME1603‑053 is the high‑memory, extended‑temperature ruggedized version in the MVME1603 family, intended for harsh industrial, outdoor, and military embedded applications that require both large ECC memory and wide temperature operation. It is functionally equivalent to MVME1603‑011 (64 MB ECC, MVME760) but built for −40 °C to +70 °C environments with full ruggedization.
The board uses a modular construction: MVME1600‑011 baseboard, PM603 PowerPC 603 processor mezzanine, and RAM104‑004 64 MB ECC DRAM module. It provides a high‑performance VMEbus SBC with integrated I/O, PCI local bus, and PMC expansion capability.
Onboard resources include 2 KB battery‑backed CMOS SRAM, battery‑backed RTC, four 32‑pin ROM sockets (up to 4 MB), and factory‑installed PPCBug firmware.
Peripherals include four EIA‑232‑D serial ports, one Centronics parallel port, 10/100 Mbps Ethernet, 32‑bit/33 MHz PCI local bus, one PMC slot, and VME64 master/slave/system controller interface.

2. Features

Processor & Memory

  • PowerPC 603 RISC @ 66 MHz

  • 16 KB I‑cache / 16 KB D‑cache

  • 64 MB ECC DRAM (soldered, non‑expandable)

  • 2 KB battery‑backed CMOS SRAM

  • Battery‑backed real‑time clock (RTC)

  • Four 32‑pin ROM/EPROM/EEPROM sockets (up to 4 MB total)

  • PPCBug firmware/debug monitor factory installed

Onboard I/O

  • Four EIA‑232‑D serial ports (Z8530 SCC)

  • One Centronics‑compatible parallel port

  • One 10/100 Mbps Ethernet controller (PCI)

  • 32‑bit, 33 MHz PCI local bus (132 MB/s max)

  • One PMC (PCI Mezzanine Card) expansion slot

  • VMEbus: VME64, Rev C, master/slave/system controller

Ruggedization & Environmental (‑053 Specific)

  • Operating temperature: −40 °C to +70 °C

  • Storage temperature: −55 °C to +85 °C

  • Relative humidity: 5%–95%, non‑condensing

  • Conformal coating: Class 3 (harsh environment)

  • Extended‑grade components

  • Enhanced shock/vibration screening for industrial/military use

System Functions

  • Two 16‑bit programmable tick timers

  • Hardware watchdog timer with system reset

  • Front‑panel LEDs: SCON, RUN, FAIL, STATUS, PCI ACT

  • Front‑panel switches: RESET, ABORT

  • Configuration: MVME1600‑011 baseboard + 64 MB ECC DRAM


3. Electrical Specifications

  • Power: +5 VDC, ±12 VDC (VMEbus standard)

  • +5 V current: 5.8 A typical, 7.5 A maximum

  • +12 V current: 150 mA max

  • −12 V current: 150 mA max

  • Logic: 3.3 V / 5 V TTL compatible

  • Power dissipation: ~12 W typical

  • Cooling airflow: 6 CFM minimum for full temperature range


4. Mechanical Specifications

  • Form factor: 6U double‑high VMEbus module

  • Dimensions: 233.4 mm (H) × 160 mm (D)

  • Weight: Approximately 880 grams

  • Conformal coating: Class 3 (all components and solder joints)


5. Supported Operating Systems

  • VxWorks (PowerPC, fully supported)

  • LynxOS

  • OS‑9

  • pSOS+

  • VMEexec

  • NetBSD/mvmeppc

  • Custom embedded real‑time operating systems


6. Compatibility

  • Pin‑compatible with MVME1603‑001/‑002/‑011/‑012/‑042

  • Software‑compatible with MVME1600 family (PowerPC 603/604)

  • MVME760 transition module compatible

  • Not compatible with MVME147/148 (68k architecture)


7. Ordering Information

  • Part Number: MVME1603‑053

  • Description: 6U VME SBC, PowerPC 603 @66 MHz, 64 MB ECC DRAM, extended temperature −40 °C to +70 °C, Class 3 conformal coating, MVME760 compatible


Get a Quote