MVME374-1
Description


1. General Description
Processor: PowerPC 603e @ 200 MHz or 750FX @ 600 MHz
Memory: Up to 1 GB SDRAM, 64–256 MB Flash
I/O: Dual Ethernet, serial ports, USB, VGA
Bus: VME64 master/slave, PCI mezzanine (PMC) support
Environment: −40 °C to +85 °C, conformal coating option
2. Key Features
PowerPC CPU: 200 MHz (603e) or 600 MHz (750FX)
Memory:
SDRAM: 64 MB standard, up to 1 GB
Flash: 64 MB standard, up to 256 MB
Dual Ethernet: 10/100 Mbps (some versions GigE)
Onboard I/O:
2 × RS‑232 serial
1 × USB 1.1
1 × VGA video
Keyboard/mouse headers
VME64 Interface: 32/64‑bit, master/slave, A16/A24/A32
PMC Expansion: 1 × PMC slot for custom I/O
Rugged: Extended temp −40 °C to +85 °C, shock/vibration resistant, conformal coating available
OS Support: VxWorks, Linux, QNX, RTOSes
Safety: Suitable for SIL 2/SIL 3 system integration
3. Technical Specifications
3.1 Processor & Core Logic
CPU: PowerPC 603e @ 200 MHz or 750FX @ 600 MHz
L1 Cache: 16 KB I + 16 KB D
L2 Cache: 256 KB (on‑chip)
3.2 Memory
SDRAM: 64 MB–1 GB (ECC optional)
Flash: 64 MB–256 MB (boot/user)
NVRAM: 128 KB (battery‑backed)
3.3 Communication Interfaces
Ethernet: 2 × 10/100Base‑T (RJ45)
Serial: 2 × RS‑232 (DB9)
USB: 1 × USB 1.1 (Type A)
VMEbus: VME64, 32/64‑bit, 5 V signaling
3.4 Mechanical & Environmental
Form Factor: 6U VME (233.4 × 160 mm)
Power: +5 VDC, ~50 W typical
Operating Temp: −40 °C to +85 °C
Storage Temp: −55 °C to +100 °C
Humidity: 5%–95% RH, non‑condensing
Shock/Vibration: MIL‑STD‑810 compliant (option)
3.5 Approvals & Compliance
CE, FCC, UL, CSA
RoHS, REACH
Suitable for SIL 2/SIL 3 system integration
4. Compatibility
VMEbus systems: All 6U VME chassis (ICS Triplex, Emerson, Motorola)
ICS Triplex T8000 SIS (as auxiliary/controller node)
Operating systems: VxWorks, Linux, QNX, custom RTOS
Peripherals: VME I/O, PMC modules, Ethernet switches, serial devices
5. Ordering Information
MVME374‑1: Standard 6U VME SBC, PowerPC, dual Ethernet, extended temp
Options:
/ECC: ECC SDRAM
/CON: Conformal coating
/GIGE: Gigabit Ethernet upgrade
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